Backplane temperature sensor

1.Overview of backplane temperature sensor products

The FT-BW1 component backplane temperature sensor is composed of a protective sheath processed by a special process for the German Heraeus platinum resistance element chip. Mainly used to measure the temperature of the surface of an object. The chip temperature sensor attaches the sensor to the surface of the object through self-adhesive glue to achieve an ideal temperature measurement effect. The contact area between the patch temperature sensor and the measured object is large and the contact is close, so it has obvious advantages in some surface temperature measurements: high temperature measurement accuracy, fast response speed, light size and easy installation. Especially it is very convenient to place on the surface of solar panels.

2. Product features of backplane temperature sensor

1. The structural design is reasonable, simple, compact and beautiful.

2. The temperature core chip is encapsulated by hot melt welding, and the outer tube is encapsulated by argon arc welding and spinning and cold extrusion.

3. The outer tube is made of light metal material and is specially oxidized to resist corrosion, rust, deformation and water leakage.

4. The sensor has excellent interchangeability and long-term stability.

5. Welding and packaging requirements are strict to ensure that the error of the sensor is not greater than ±0.2°C at -50°C to 100°C.

6. It should not be affected by environmental factors such as dust and chemical gases.

3. Technical indicators of backplane temperature sensor